log bac2
log sp
Adhesive Films from SP-High Modulus
SP-High Modulus Adhesive Films are designed for secondary bonding, core-bonding and for co-curing with the range of SP-High Modulus prepregs and SPRINT®.  They are toughened for impact resistance and peel strength, and are subject to controlled flow for maximum bond integrity.
The adhesive films are available at various weights, with or without a carrier, and are divided into SA70 films, (for use with the SE70 range of prepregs) and SA80 films, (for use with the SE84 range of prepregs), and can be supplied pre-coated on to SP-High Modulus Prepregs.


SA 70 – Epoxy Adhesive System
Low temperature cure
Designed for bonding prepreg skins to honeycomb and certain foam cores
Compatible with SE 70 prepregs
Toughened for impact resistance and peel strength
Controlled flow for maximum bond integrity

download datasheet SA70



SA 80 – Toughened Low Energy Cure Epoxy Adhesive Film
Low temperature cure
Designed for bonding prepreg skins to honeycomb and certain foam cores
Compatible with SE 84 & SE 85 prepregs and SPRINT® products
Toughened for impact resistance and peel strength
Controlled flow for maximum bond integrity

download datasheet SA80
Pacific college medycyny orientalnej http://kupicpigulki.pl/viagra/ GE healthcare karty kredytowej